Description
Designed a compact, modular small form factor PC case focused on portability, thermal performance, and serviceability using CFD-driven airflow validation.
The enclosure fully integrates all PC components within a compact 425 × 142 × 137 mm volume, optimizing space efficiency while maintaining accessibility and structural rigidity.
- Designed modular aluminum extrusion frame for structural support and easy assembly/disassembly.
- Used ABS/ASA 3D printing for custom structural and enclosure components with improved heat resistance.
- Performed CFD simulations to optimize airflow paths and reduce thermal hotspots.
- Integrated snap-fit SSD mounting mechanism for fast swapping and tool-less storage access.
- Added side-mounted LCD display showing real-time CPU/GPU usage, CPU temperature, and memory load.
- Implemented internal cable management strategy for improved airflow and clean assembly.
- Designed rubber feet for improved stability, vibration damping, and desk grip.
- Iterated design for manufacturability, assembly efficiency, and compact packaging constraints.
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